| Products | Standard ICs | Packaging |
Low-profile Fine-pitch Ball Grid Array (LFBGA)
Introduction
In support of customer demand and the industry's trend toward smaller, more compact designs,
NXP, Texas Instruments (TI), and Integrated Device Technology, Inc. (IDT) have agreed to source logic devices with the same functionality and pin-outs in space-saving, low-profile, fine-pitch ball grid array (LFBGA) packaging.
This initiative marks the first implementation of BGA packaging in logic devices.
Space-constrained devices such as wireless telephone systems, base stations, networking systems, memory modules, and handheld computers are ideal applications for logic devices in LFBGA packages.
Key Benefits/Features
When compared to existing logic devices in other types of packages, such as TSSOP (thin shrink small outline package), the new LFBGA package will reduce board space by up to 65 percent for the same functionality.
Compared with alternative types of packaging, the 0.8-mm ball pitch LFBGA logic package provides improved characteristics in areas such as electrical and thermal performance.
The LFBGA package reduces inductance by 45 percent over TSSOP packages.
Additionally, the small impedance variations between the package's pins results in a lower skew rate.
In tests comparing the thermal performance of this LFBGA package with TSSOP packages, the LFBGA was found to be up to 50 percent more efficient at dissipating heat.
Products
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LFBGA Products
| | SC16C654B | | 2.5V/3.3V/5V quad UART with 64-byte FIFOs and infrared (IrDA) encoder/decoder; up to 5Mbps; Motorola interface package option | |||||||||||||||||||
| | CBTU4411 | | 11-bit DDR2 SDRAM mux/bus switch with 12Ω on-resistance | |||||||||||||||||||
 | LH79524 |  | System-on-Chip with ARM720T microcontroller, 16KB SRAM, LCD controller up to true color or XGA, touch screen controller, MMU, AHB, APB, 32-bit external memory interface, USB 1.1 full speed device, 10/100 ethernet, I2C, 10-bit ADC | |||||||||||||||||||
| | LH7A400 | | System-on-Chip with ARM9TDMI microcontroller, 80KB SRAM, LCD controller up to 16-bit and XGA, MMU, AC97 audio, AHB, APB, external memory interface, USB 1.1 full speed device, PCMCIA, CF, MMC, Smart Card | |||||||||||||||||||
| | LH7A404 | | System-on-Chip with ARM9TDMI microcontroller, 80KB SRAM, LCD controller up to 16-bit and XGA, touch screen controller, MMU, AC97 audio, AHB, APB, external memory interface, USB 1.1 full speed host/device, PCMCIA, CF, SD/MMC, Smart Card, 9x10-bit ADC, PS/2 | |||||||||||||||||||
| | LPC3180 | | See LPC3180/01 replacement | |||||||||||||||||||
| | LPC3180/01 | | ROMless ARM9 microcontroller with SDRAM interface, USB On-The-Go | |||||||||||||||||||
| | PX1011A | | PCI Express stand-alone X1 PHY; See PX1011B replacement | |||||||||||||||||||
| | PX1011B | | PCI Express stand-alone X1 PHY with improved transmitter jitter and supply range | |||||||||||||||||||
Functions Literature Models Support Docs Consultants Price More... | ||||||||||||||||||||||
| | PX1012A | | PCI Express stand-alone X1 PHY for PLDA's IP core; See PX1011B replacement | |||||||||||||||||||
16-Bit LFBGA Products
32-Bit LFBGA Products
Packaging
LFBGA Dimensions
 96 Ball |
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 114 Ball |
 TSSOP/LFBGA Comparison |
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 LFBGA Side View |
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